1. DIE is die
DIE.CPB1
DIE.CPB2
...
DIE.CPB7
Stacked die in die BGA package;
chip bond pads
2.
DIE.CBPAssignment1
Assignment1
Count
Height
Length
Width
DIE.FormatId
DIE.SBP1
DIE.SBPGuideCount
DIE.WB1
DIE.WBCount
DIE.WBRules.MaxAngle
DIE.WBRules.MaxLength
DIE.WBRules.MinLength
DIE.WBRules.WBtoPad
DIE.WBRules.WToWDistance
3.
Geometry.Height
Manufacturer #1
Part_Field_Name_1
4.
Rules.Clearance.Board.Pad
(Board,Copper,Drill,SMD,Text)
to(Pads,SMD,Trace,Via)
Pad to (pad,trace,via)
Trace to Trace
via to (Trace,via)
Rules.Width.Maximum,Rules.Width.Minimum,Rules.Width.Recommended
Rules.ViaAtSMD.FitInside
Rules.SameNet.Pad.Crn,Rules.SameNet.SMD.Via
Rules.PadEntry.AnyAngle,Rules.PadEntry.Side,Rules.PadEntry.Corner,Rules.PadEntry.Soft;
Rules.Fanout.Alignment;
Rules.Fanout.Alignment.Multi-Row;
Rules.Fanout.Direction;
Rules.Fanout.Length.Maximum;
Rules.Fanout.Length.Unlimited;
Rules.Fanout.Nets.Plane;
Rules.Fanout.Nets.Signal;
Rules.Fanout.Nets.UnusedPins;
Rules.Fanout.Sharing.Pin;
Rules.Fanout.Sharing.SMD;
Rules.Fanout.Sharing.Trace;
Rules.Fanout.Sharing.Via;
Rules.Fanout.ViaSpacing;
5.
Body Style 元件类型
Voltage Rating 额定电压
T.C.R or TCR(Temperature
Coefficient of Resistance [电]
电阻温度系数)
Rating 额定值
Polar 极性，极坐标
Reference 参考，引用
Tolerance 公差，耐受性
Current Rating 额定电流
Created by/date Sean6/2014-0528
Checked by/date Sean6/2014-0528